grinding induced depth

grinding induced depth

Models of grinding-induced surface and subsurface

2021-9-1  This paper has established the correlations between the subsurface crack depth and the scratch depth induced by spherical, pyramidal, and conical indenters, respectively. Subsequently, the models of SD and SSD depths are developed for the ground brittle material, which are related with grinding parameters, abrasive grit parameters, and ...

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Indentation behavior of creep-feed grinding induced ...

In this work, the gradient structures along depth within the creep-feed grinding induced surface layer were revealed, including nanograins (50–100 nm in size), submicron grains (100–200 nm in size) and the dislocation structures.

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Cup wheel grinding-induced subsurface damage in optical ...

2019-5-1  Cup wheel grinding-induced surface and subsurface damage in optical glass BK7 was investigated. • A theoretical model of grinding-induced SSD depth considering the ductile-regime effect was applied. • A coupled FEM and SPH 3D model was provided to simulate the grinding-induced SSD in optical glass BK7. •

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Grinding induced subsurface cracks in silicon wafers

2006-5-21  In order to assess the depth and nature of grinding induced subsurface cracks in silicon wafers, it is desirable to categorize all the possible crack configurations. This knowledge may help to develop models that can explain the formation of different subsurface cracks. However, to our

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Experimental study on grinding-induced residual stress in ...

2019-12-2  Grinding process Grinding conditions. As shown in Table 2, three grinding process parameters, namely wheel speed (v s), workpiece speed (v w), and grinding depth (a p), were selected with four levels.The levels of these three parameters were chosen based on the working conditions of precision grinding or micro-grinding of the maraging steel critical components in the aerospace industry.

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Grinding Induced Changes in Residual Stresses of ...

2014-7-17  The grind depth reported is the perpendicular distance from the unfi nished profi le to the fi nished profi le (Fig. 6). The increased tip relief observed in the sample designated Finished 3 is quite noticeable. With the exception of the tip relief found in Finished 3, the grind depth is similar for all radii greater than the form radius. The

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Measurement and modeling methods of grinding-induced ...

2021-6-12  Similarly, a sound knowledge of the grinding-induced residual stress has been reported; however, few concerned about gears . As for the modeling method of grinding process, the cutting chip is regarded as a geometry with a same cross-section shape at each point in the direction of the contact line . However, this model is not applicable for ...

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Grinding induced damage in ceramics - ScienceDirect

2003-1-10  Abstract. Although grinding is widely used as a productive technique for finishing ceramic components in the manufacturing industry, it often causes damage to the machined components. The exact nature, the manner and the penetration depth of grinding-induced damage are, however, still not clear, leaving many uncertainties and sometimes danger ...

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Grinding depth vs wafer radial distance under various ...

This paper proposes an analytical model for predicting grinding-induced sub-surface damage depth in a silicon wafer. The model integrates the dislocation kinetics for crack initiation and fracture ...

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Grinding Induced Damage in Ceramics - researchgate.net

The exact nature, the manner and the penetration depth of grinding-induced damage are, however, still not clear, leaving many uncertainties and sometimes danger in using ceramics for structural ...

Read More
Indentation behavior of creep-feed grinding induced ...

In this work, the gradient structures along depth within the creep-feed grinding induced surface layer were revealed, including nanograins (50–100 nm in size), submicron grains (100–200 nm in size) and the dislocation structures.

Read More
Models of grinding-induced surface and subsurface

2021-9-1  This paper has established the correlations between the subsurface crack depth and the scratch depth induced by spherical, pyramidal, and conical indenters, respectively. Subsequently, the models of SD and SSD depths are developed for the ground brittle material, which are related with grinding parameters, abrasive grit parameters, and ...

Read More
Grinding induced damage in ceramics - ScienceDirect

2003-1-10  Abstract. Although grinding is widely used as a productive technique for finishing ceramic components in the manufacturing industry, it often causes damage to the machined components. The exact nature, the manner and the penetration depth of grinding-induced damage are, however, still not clear, leaving many uncertainties and sometimes danger ...

Read More
Cup wheel grinding-induced subsurface damage in optical ...

2019-5-1  Cup wheel grinding-induced surface and subsurface damage in optical glass BK7 was investigated. • A theoretical model of grinding-induced SSD depth considering the ductile-regime effect was applied. • A coupled FEM and SPH 3D model was provided to simulate the grinding-induced SSD in optical glass BK7. •

Read More
Grinding induced subsurface cracks in silicon wafers

2006-5-21  In order to assess the depth and nature of grinding induced subsurface cracks in silicon wafers, it is desirable to categorize all the possible crack configurations. This knowledge may help to develop models that can explain the formation of different subsurface cracks. However, to our

Read More
Measurement and modeling methods of grinding-induced ...

2021-6-12  Similarly, a sound knowledge of the grinding-induced residual stress has been reported; however, few concerned about gears . As for the modeling method of grinding process, the cutting chip is regarded as a geometry with a same cross-section shape at each point in the direction of the contact line . However, this model is not applicable for ...

Read More
Experimental study on grinding-induced residual stress in ...

2019-12-2  Grinding process Grinding conditions. As shown in Table 2, three grinding process parameters, namely wheel speed (v s), workpiece speed (v w), and grinding depth (a p), were selected with four levels.The levels of these three parameters were chosen based on the working conditions of precision grinding or micro-grinding of the maraging steel critical components in the aerospace industry.

Read More
Grinding-induced metallurgical alterations in the binder ...

2017-12-1  Grinding induced severe plastic deformation of the Co in the near surface region, and it resulted in refinement of the binder grains. The refinement was more pronounced close to the surface where the strain was high, i.e. formation of nanocrystalline grains down to a depth of around 1 μm.

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Grinding depth vs wafer radial distance under various ...

This paper proposes an analytical model for predicting grinding-induced sub-surface damage depth in a silicon wafer. The model integrates the dislocation kinetics for crack initiation and fracture ...

Read More
Grinding Induced Damage in Ceramics - researchgate.net

The exact nature, the manner and the penetration depth of grinding-induced damage are, however, still not clear, leaving many uncertainties and sometimes danger in using ceramics for structural ...

Read More
Models of grinding-induced surface and subsurface

Based on the indentation fracture mechanics of brittle material, the correlations between the subsurface crack depth and the scratch depth induced by pyramidal, conical, and spherical indenters are established, respectively. Combined the kinematics of grinding process, the theoretical models of surface damage (SD) and subsurface damage (SSD ...

Read More
Grinding Induced Changes in Residual Stresses of ...

2014-7-17  The grind depth reported is the perpendicular distance from the unfi nished profi le to the fi nished profi le (Fig. 6). The increased tip relief observed in the sample designated Finished 3 is quite noticeable. With the exception of the tip relief found in Finished 3, the grind depth is similar for all radii greater than the form radius. The

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Thermal effects on mechanical grinding-induced surface ...

2011-1-31  Thermal effects on mechanical grinding-induced surface texture in tetragonal piezoelectrics - Volume 22 Issue 10

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Creep feed grinding induced gradient microstructures in ...

2021-8-30  Nevertheless, studies of grinding induced surface alterations have rarely been reported for single crystal nickel-based superalloys. Hence, two major questions remain unanswered: (a) how does the grinding induced surface alteration behave in microstructures, and (b) does mechanical grinding benefit the material performance via grain refinement.

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Formation of subsurface cracks in silicon wafers by grinding

2020-12-23  Gao et al. studied the distribution of grinding-induced SSCs and found that the detected depth of SSCs was different at different orientations. SSCs in the 110 orientations were deeper than those in the 100 orientations. 7 7.

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Experimental Investigation on Grinding-Induced Surface ...

The single factor experience of Fiber Reinforced Ceramic Matrix Composites (briefly named FCC) grinding was done on a NC optical curve grinding machine, and then the morphologie of the grinding surface was observed with an optical microscope. The effect of the grinding parameters, which include mainly grinding depth, abrasive grain size of diamond grinding wheel and grinding direction, on the ...

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Grinding-induced metallurgical alterations in the binder ...

2020-7-23  ACCEPTED MANUSCRIPT Grinding-induced metallurgical alterations in the binder phase of WC-Co cemented carbides J. Yang1,2, J.J Roa1,3, M. Schwind4, M. Odén2, M.P. Johansson-Jõesaar2,4 and L. Llanes1,3 1 CIEFMA - Departament de Ciència dels Materials i Engenyeria Metallúrgica, Campus Diagonal Besòs-EEBE, Universitat Politècnica de Catalunya, Barcelona 08019, Spain

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Experimental Investigation on Grinding-induced Surface ...

The effect of the grinding parameters, which include mainly grinding depth, abrasive grain size of diamond grinding wheel and grinding direction, on the grinding-induced surface damage of FCC was discussed, finally, the paper drew the conclusions that both increasing of grinding depth and increasing of abrasive grain sizes of diamond wheel can ...

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[PDF] Grinding induced subsurface cracks in silicon wafers ...

Grinding induced subsurface cracks in silicon wafers. Silicon wafers are used for production of most microchips. Various processes are needed to transfer a silicon crystal ingot into wafers. To ensure high surface quality, the damage layer generated by each of the machining processes (such as lapping and grinding) has to be removed by its ...

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Experimental evaluation and surface integrity analysis of ...

2021-10-25  Some authors call this zone as Grinding-Induced Layer ... M. Effect of nozzle angle and depth of cut on grinding titanium under cryogenic CO2. Mater. Manuf. Process. 33, 1466–1470.

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